In 2004, PaytonTechnology (Shenzhen) Co., Ltd. (hereinafterreferred to as Payton) was established in Futian District, Shenzhen. With a registered capital of RMB 1.748 billion and a total investment of RMB 2 billion. Since its establishment, Payton has been focusing on high-endmemory chip (DRAM, NAND FLASH) assembly and testing services, with assembly and testing mass production capabilities for dynamic memory chip and SSD.

At present, Payton has over 20 years of experience and technical reserves, the assembly test engineering teamis now capable of assembly solutions and analysis for many types of products,and can provide diversified test solution development and optimization services according to customer needs.

Shenzhen Payton is responsible for the overall operationand management as the operation headquarters and production base in South China. Hefei Payton Storage Science and Technology Ltd. was establishedin October 2020 as a holding subsidiary in the Airport Demonstration Zone of Hefei Economic and Technological Development Zone with a registered capital of RMB 3.06 billion. As the operation base of Payton in East China, Hefei Payton will provide one-stop service model of bumping, assembly, testing and moduleassembly in cooperation with major domestic customers. The company has set upan advanced assembly and testing technology R&D center for R&D planning and layout. Supported by a Japanese R&D team with over 30 years of experience in advanced assembly and testing, we actively promote the development and mass production of new products and technologies to meet theneeds of our domestic business.

With the long-standing values of "Respect, Communication, Execution and Initiative" and the philosophy of "excellent quality, core making with heart", Payton will continue to develop new business models and technological innovations to meet theever-expanding and changing market needs.